I, LED package types

(A) plug-in (ThroughHole)

1, with both sides of the vertical line leads to: ceramic porcelain fused two-out double-sealed plastic two-out double row of metal out of plastic narrow-body shrink plastic two-out double row

2, Ping Shen lead two leads: ceramic flat ceramic seal melt plastic flat flat flat metal

3, bottom of vertical rise to lead: a separate plastic plastic "Z"-shaped metal wire 4 diamond-shaped metal metal metal round four round-lead ceramic pin grid formation plastic pin grid formation

4, single-sided vertical rise to lead: metal wire leads to a flat-sided plastic bending lead separate

(B) of the surface-mount type (SurfaceMount)

1, the side wing Wire leads: plastic small outline plastic lead chip carrier wing wing-lead ceramic chip carrier

2, lead the side "J" shaped leads: plastic small outline plastic "J"-lead ceramic chip carrier "J"-lead plastic chip carrier anti-"J"-lead ceramic chip carrier anti-"J" shaped lead Chip Vector

3, Ping Shen lead four leads: four plastic-lead ceramic flat surrounded by flat-lead

4, leadless ceramic chip carrier

(C) direct-bonded (DirectBonding)

1, flip-chip package

2, plate-chip package

3, contains the package with automatic

Second, the package name

State of the existing integrated circuit packaging and the name of the letter on behalf of the 1, ceramic flat pack-F; 2, melt sealed ceramic flat pack-H; 3, double row of ceramic packaging-D; 4, melting ceramic seal two-out letters J-loaded; 5, two-out plastic packaging P-type; 6, metal T-round package; 7, the metal diamond package-K; 8, plastic small outline package type O; 9, plastic chip carrier closure E-mounted; 10, surrounded by plastic-N-lead flat pack; 11, ceramic chip carrier package type C; 12, ceramic pin grid formation package-G; 13, surrounded by ceramic flat pack lead-Q; 14 , Glass-ceramic flat pack-W; 15, double row of metal packaging-M; 16, the metal packaging 4-Ms; 17, the metal flat pack-Mb; 18, four metal packaging Ts-round lead; 19, a separate index-Ft-coated package; 20, two-out package Gf-reperfusion;

Note: (1) Section 14 of flat glass ceramic package are not included in national standards;

(2) 15 to 20 used only for hybrid integrated circuit packaging and film circuits.

Third, the package code

Code package is made up of four or five parts. For the first part of the letter, said the package of materials and structural forms, that is, the above-mentioned name of the package; Arabic numerals in the second part, that leads to a number of side (lead less than 10, should be in place before the month 0); with the third part of the letter Or the number of components, packaging products, said the main difference in size or shape; the fourth part of the figures, said minor differences in size; with the fifth part of the letter, said that structural differences.